Embracing the new opportunities of heterogeneous integration, the 2021 user conference of Xinhe Semiconductor was successfully held
Chip and semiconductor, a leading enterprise in the domestic EDA and filter industries, recently successfully held its 2021 National User Conference in Shanghai. This conference, co-organized by Shanghai Integrated Circuit Industry Association and Shanghai Integrated Circuit Technology and Industry Promotion Center, brought together many partners in the chip and semiconductor and its ecosystem: ZTE, UNISOC, Synopsys, Luo With the theme of “Embrace the New Opportunities of Heterogeneous Integration”, the senior executives and experts of German & Schwarz, Microsoft Azure, and Gelun Electronics shared with more than 200 colleagues in the industry how the semiconductor industry in the era of heterogeneous integration has experienced EDA, Status and trends of upstream and downstream links in the industrial chain such as design, manufacturing, packaging and testing, and cloud platforms.
Leaders attending this conference included Fu Xinhua, Deputy Director of Shanghai Municipal Commission of Economy and Information Technology, Chen Ming, Director of High-tech Division of Shanghai Municipal Science and Technology Commission, and Dr. Xu Xin, Director of Shanghai Pudong New Area Science and Technology and Economic Commission.
The conference was opened by Fu Xinhua, Deputy Director of Shanghai Municipal Commission of Economy and Information Technology. He mentioned that Xinhe Semiconductor is a key EDA enterprise in Shanghai. In the past year, the rapid development of the company is worthy of praise, and he encouraged Xinhe to take the direction of specialization, specialization and innovation to undertake the revitalization of the semiconductor industry and EDA given by the times. The mission of the industry, and contribute to the construction of our Shanghai Science and Technology Innovation Center.
One of the co-organizers of this event, Xu Xiufa, Deputy Secretary-General of Shanghai Integrated Circuit Industry Association, also encouraged Chip and Semiconductor to continue to work hard in his speech, play a leading role in the domestic EDA industry, and help China’s integrated circuit industry forge ahead.
“The epidemic has accelerated the global industry’s transformation to digital, and the semiconductor industry’s important contribution to this comes from HPC high-performance computing technology. Advanced processes, advanced packaging and high-speed systems are the three important supports for the development of HPC.” Dr. Ling Feng, founder and CEO of Semiconductor, said, “Sinohe has formed a complete EDA product line driven by system analysis, covering chip-package-system, supporting advanced technology and advanced packaging, which can be used for the most urgent HPC applications. Industries – Data centers, cloud computing, 5G communications, artificial intelligence, big data analytics, and smart cars provide powerful solutions.”
Dr. Wenliang Dai, co-founder and senior vice president of Xinhe Semiconductor, released the Xpeedic EDA2021 version at the conference, providing a complete modeling, simulation, analysis and test platform for Electronic systems. This year’s star is the industry’s first unified platform for 3DIC advanced package design analysis released by Synopsys and Synopsys, providing customers with a fully integrated, high-performance, and easy-to-use environment that 3DIC full-process solution from verification, signal integrity simulation, power integrity simulation to final signoff. In addition to EDA, Dr. Dai also focused on the core and filter solution XFilter: with the IPD process supplemented by SAW and BAW processes, the core provides a diversified filter product portfolio, which can meet the needs of higher frequency, wider bandwidth and Diversified requirements for better insertion loss and out-of-band suppression performance, and the use of virtual IDM models to help RF module manufacturers achieve product innovation.
Yi Bi, vice minister of ZTE, the world’s leading communication system service provider, Liu Zhinong, senior vice president of UNISOC, China’s leading wireless communication terminal core chip supplier, and Xinyi, the world’s number one EDA solution provider. Xu Wei, the deputy general manager of Cisco Technology in China, made a wonderful sharing of “heterogeneous integration”, “3DIC”, “advanced packaging” and “system design” in the keynote speech session of the conference, and gave a great introduction to the 3DIC launched by Xinhe. The full-process EDA platform for advanced packaging design analysis has expressed strong expectations.
This user conference is divided into two technical sub-forums, “Analog RF System Design” and “High-speed System Design”. Experts and partners of Chips and Semiconductors shared a number of popular industry applications, including “2.5D/3D Heterogeneous Integration of “Cross-scale co-simulation” solution; high-speed SerDes system simulation and optimization platform; high-speed analog circuit passive device design simulation platform; 5G RF front-end filter trend challenges and responses; high-speed parallel system (SI/PI) and measurement verification solutions ; PDK develops full-process solutions; RF system simulation and optimization platform in the 5G era; a powerful tool to improve simulation efficiency – core and cloud platform, etc.
For a long time, Xinhe Semiconductor has been committed to the construction of the ecosystem. The company has maintained partnerships with the world’s top six wafer fabs, the top five EDA manufacturers, and the world’s top two cloud platform manufacturers, Amazon AWS and Microsoft Azure. Xinhe’s vision is to join hands with domestic IC design, wafer fabs, packaging and testing plants, and system manufacturers to jointly promote the development of China’s integrated circuit industry.
The Links: G084SN05-V9 2MBI200KB-060