Avnet Introduces MaaXBoard Nano Single Board Computer

Beijing, China, February 26, 2021 – Avnet (NASDAQ: AVT), a leading global provider of technology solutions, announced the MaaxBoard Nano single-board computer designed to help customers speed time-to-market and reduce development costs. The introduction of this production-ready single-board computer further expands Avnet’s hardware product lineup. The MaaxBoard Nano single-board computer is powered by NXP’s i.MX 8M Nano processor for embedded computing and edge intelligence-driven IoT applications. It has 4 built-in microphones and 1 audio interface, which can provide high-quality audio output. The product has also passed the US Federal Communications Commission (FCC) certification, EU CE certification and RoHS certification. MaaxBoard Nano provides more flexibility for product design and testing, allowing users to focus more on software development and design during product development.

MaaXBoard Nano is fully configured to support and create operating systems based on Linux, Android or other OS. The platform integrates a variety of onboard peripherals, including 1GB of DDR4 memory, 1 Gigabit Ethernet port, 4 USB 2.0 host ports, MIPI-DSI interface, WiFi, Bluetooth, MicroSD card slot, 4 onboard Microphone and 1 audio interface. Expansion connectors compatible with the Raspberry Pi Expansion Board (HAT) also provide UART, SPI, I2C and GPIO interfaces.

“Our i.MX 8M Nano single-board computer is inexpensive,” said Jim Beneke, vice president of products and emerging technologies at Avnet. “With this hardware solution, developers can focus on designing the software. Maaxboard Nano is Avnet’s NXP-based The latest addition to the MaaXBoard series of single-board computers from E-Board, when used with Avnet’s IoTConnect platform, can be further expanded and is ideal for applications such as artificial intelligence, Internet of Things, industrial automation, multimedia and audio.”

Avnet’s IoTConnect platform is cloud-based and highly scalable, addressing common industry needs and challenges. With a standardized approach to effectively harnessing the Internet of Things, developers can create intelligent applications and solutions on the platform, further extend functionality, deliver best practices, and truly enable data-driven decision-making. IoTConnect platform uses Microsoft’s enterprise-grade Azure hybrid cloud computing service, which is very secure and reliable, and can support seamless data distribution and data analysis across cloud and local systems.

The MaaXBoard Nano single-board computer designed by Avnet is equipped with NXP’s i.MX 8 series applications processors. Based on Arm® Cortex®-A53 and Cortex-M4 cores, NXP’s i.MX 8 series applications processors provide industry-leading audio, voice and video processing for consumer-grade home audio, industrial-grade building automation and embedded computer and other applications.

The MaaxBoard Nano is now available in the Americas, Europe and China for $80.95 (about 523.35 RMB).

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Eview MT506LV4CN New Stock

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Install Environment Where Used
The MT-500 Series is designed for use in a factory environment. It is designed to
operate from 32 to 113 °F (0 to 45 °C) temperatures, as found in most industrial
environments. It may not be suitable for use in certain outdoor applications. Please
consult the factory for advised usage in outdoor applications.
NEMA Rating
The MT-500 Series front bezel is NEMA 4 rated. When installed properly in a NEMA
4 panel, the NEMA 4 rating of the panel will not be compromised. This means that
fluids will not enter the panel during wash downs.
Electrical Environment
The MT-500 Series has been tested to conform to European CE requirements. This
means that the circuitry is designed to resist the effects of electrical noise. This does
not guarantee noise immunity in severe cases. Proper wire routing and grounding
will insure proper operation.
Mechanical Environment
Avoid installing units in environments where severe mechanical vibration or shocks
are present. 
Panel Details
The unit can be mounted into panels with a depth of 4” (105mm). It is recommended that the unit be mounted on the front panel of a steel enclosure, through an appropriate opening*. Allow a clearance of 1”(25mm) around the sides of the unit for mounting hardware. Allow clearance for cable connections to the back of the unit. Unit depth may vary according to cable type used. Typically, plan a depth to accommodate at least 4” (105mm) behind the panel.
NEMA-4 Mounting
Put the unit through the panel cut out. Slide the clamps into the 6 holes provided around the case. Tighten the clamping screws in an even pattern until the unit is secured in the panel.
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AUO M170EG01 V9 New Stock

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Email: sales@shunlongwei.com

Brand AUO
Model M170EG01 V9  Compatible Model 1 Compatible
Diagonal Size 17.0 inch
Type a-Si TFT-LCD, LCM
Pixel Format 1280(RGB)×1024  [SXGA]  96PPI
Configuration RGB Vertical Stripe
Active Area 337.92(H)×270.336(V) mm
Outline Dim 358.5(H)×296.5(V) ×17.5(D) mm
Bezel Area 341.6(H)×274.0(V) mm
Treatment Glare (Haze 0%), Hard coating (2H)
Luminance 420 cd/m² (Typ.)
Contrast Ratio 500:1 (Typ.) (TM)
View Direction 12 o’clock
Response Time 6/2 (Typ.)(Tr/Td)
Viewing Angle 70/70/70/60 (Typ.)(CR≥10) Left / Right / Up / Down
Operating ModeTN, Normally White, Transmissive
Support Color16.2M   72% NTSCLight SourceCCFL  [4 pcs] , 50K hours , W/O Driver
Weight1.90Kgs (Typ.)Designed ForDesktop Monitor
Frame Rate60HzTouch PanelWithout
Interface TypeLVDS (2 ch, 8-bit) , 30 pins Connector
Power Supply5.0V (Typ.)
EnvironmentOperating Temperature: 0 ~ 50 °C ; Storage Temperature: -20 ~ 60 °C
M170EG01 V9 inverter, M170EG01 V9 power supply, M170EG01 V9 electronic board, M170EG01 V9 VGA board, M170EG01 V9 touchscreen available.

ASML makes efforts, EUV lithography will usher in a major upgrade

Beginning in 2019, fabs began to use extreme ultraviolet (EUV) lithography to a limited extent for high-volume manufacturing (HVM) of chips. At that time, ASML’s Twinscan NXE series lithography machines were able to meet the basic production needs of customers, but the entire EUV ecosystem was not ready for everything. One of the factors affecting EUV was the lack of protective films for photomasks (protective pellicles for photomasks), which limits the use of EUV tools and affects yield.

Fortunately, thanks to the recent introduction of production-ready EUV fenders, the pellicle situation has finally improved, and the situation is expected to improve over the next few years.


Having made great strides in recent years with its Twinscan NXE EUV lithography tool, ASML has improved the light source performance, availability time and productivity of EUV lithography machines. Its industry peers have also done a lot of work to enable high-volume manufacturing (HVM) using EUV equipment. Nonetheless, the EUV ecosystem still needs further development. One of the most notorious challenges the semiconductor supply chain faces with EUV is the development of pellicles, which were not available two years ago, which is why TSMC and Samsung Foundry had to invent how to use them Method for EUV scanner without protective film.


A 16nm TSMC Pellicle With Reticle

Pellicle protects 6 x 6 inch photomasks (reticles) during the chip production process by isolating them from particles that may fall on their surfaces, which could otherwise damage them during the process or cause damage during production cause defects to the wafer. Each EUV tool reticle costs $300,000, so chipmakers are desperate to find new ways to protect their wafers from particles and even the EUV radiation itself, as it reduces costs. At the same time, it may be even more important to reduce the risk associated with yields.

Meanwhile, the demand for pellicles varies according to the manufacturer and the type of photomask used. Known for its large CPU dies, Intel tends to use a single die, meaning that just one mask defect introduced by a particle automatically kills the entire die. At the same time, if a 25-die photomask is used, the particle adder will “only” result in a 4% reduction in yield (one dead die), which is why for smaller chips and multi-die photomasks, no guards need to be used The reason why the pellicles can get away with it.

The industry started developing protective films for EUV tools after learning that no one can guarantee that the ultra-complex EUV scanners are 100% free of harmful particles, which is relatively late, which is why they are not yet ready in 2019 reason.

Photomask pods for use with deep ultraviolet (DUV) lithography equipment are common and inexpensive. In contrast, since EUV photomasks are different from DUV photomasks (EUV masks are essentially 250 to 350 nm thick stacks with 40 to 50 alternating layers of silicon and molybdenum on the substrate), Therefore, the protective film of this kind of marking is also very different. In particular, EUV light has a very short wavelength, which means its protective film has many requirements, making it difficult and expensive to produce. The EUV pellicle must be very thin, should not affect the reflective properties of the reticle, should have high transmittance (the higher the transmittance, the higher the productivity of the scanner), should maintain high EUV power levels and withstand extreme temperatures ( from 600°C to 1,000°C in the future).

“Most materials are very absorptive at the 13.5nm EUV wavelength, and even with most EUV-transparent materials chosen, the films would have to be very thin to achieve 90 percent transmission,” said IMEC’s ​​Emily Gallagher. Such films often do not maintain sufficient strength to stand alone at the required dimensions. In addition, the EUV scanner environment is incompatible with many materials, subjecting the pellicle to the action of a pump-exhaust cycle.”

According to SemiEngineering, to date, a number of EUV protective film options have emerged including:

ASML launched its first EUV pellicle in 2019 and licensed the technology to Mitsui Chemicals, which plans to start volume sales in the second quarter of 2021. ASML has since improved the protective film;

Imec has published test results of its carbon nanotube-based pellicle;

Graphene Square, Freudenberg Sealing Technologies (FST) and some universities are developing their own protective films;

So far, only ASML has managed to create a commercially viable protective film for a practical EUV tool. ASML’s pellicle is based on polysilicon with a thickness of 50 nm. Back in 2016, they demonstrated a 78% transmission rate on a simulated 175W light source. Currently, ASML can sell protective films with 88% transmittance. Soon, Mitsui will start supplying such protective films in large quantities.

The latest prototype from ASML, made of metal silicide, demonstrated 90.6% transmittance, 0.2% non-uniformity, and less than 0.005% reflectance under a 400W light source.

“This upgrade supports our roadmap, which will eventually enable power supplies up to 400 watts,” Raymond Maas, ASML’s product manager for pellicle films, told Bits & Chips.nl. “At that power level, the film is heated to 600°C. , and polysilicon can’t afford it.”

In comparison, Imec’s prototype pellicle had a transmittance of 97.7 percent. In fact, in the long run, when more advanced light sources can be used, more complex pellicles will be required, and this is where Imec’s carbon nanotube-based pellicles will come into play.

“Few materials have the potential for high EUV transmittance over 90%, and even fewer are compatible with EUV powers over 600W at the same time. Also, the pellicle must be strong enough to hang over a large area reticle (? 110mm x 140mm),” said researcher Joost Bekaert from Imec.

Unfortunately, it’s unclear when Imec’s carbon nanotube-based shield will be ready.

Now, TSMC and Samsung Foundry have invented a way to use EUV lithography tools to produce multi-die masks for smaller chips without the need for a pellicle, but this approach is risky as any particle additives may become a defect that leads to a decrease in yield. Furthermore, such an approach is risky for larger chips and single-die photomasks, so pellicles are critical for the fabrication of large dies using EUV tools. That said, regardless of the size of the photomask, pellicles are required to increase EUV yield and reduce risk across the field.

Overall, the use and improvement of EUV protective film will be a gradual process. The initial pellicle developed and manufactured by ASML, and soon to be manufactured by Mitsui, is adequate for some of today’s needs, but its transmission levels still have room for improvement, as evidenced by next-generation prototypes from ASML and Imec. Since these machines will have more powerful light sources, better protective films will also be needed for future scanners. However, because such protective films have many indisputable advantages, they will be used by chipmakers because they can help increase yield even at the cost of some productivity.


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CPT CLAA170EA07Q New Stock

#CLAA170EA07Q CPT CLAA170EA07Q New CPT 17inch LCM 1280×1024 300 500:1 80/80/60/70 16.7M CCFL LVDS; , CLAA170EA07Q pictures, CLAA170EA07Q price, #CLAA170EA07Q supplier

Email: sales@shunlongwei.com

Brand CPT
Model CLAA170EA07Q   Compatible Model 2 Compatible
Diagonal Size 17.0 inch
Type a-Si TFT-LCD , LCM 
Pixel Format 1280(RGB)×1024  [SXGA]  96PPI
Configuration RGB Vertical Stripe
Active Area 337.92(H)×270.336(V) mm
Outline Dim. 358.5(H)×296.5(V) ×17.5(D) mm
Bezel Area 341.6(H)×274.0(V) mm
Treatment Antiglare
Luminance 300 cd/m² (Typ.)
Contrast Ratio 500:1 (Typ.) (TM)    
View Direction 6 o'clock
Response Time 8 (Typ.)(Tr+Td)
Viewing Angle 80/80/60/70 (Typ.)(CR≥10) Left / Right / Up / Down
Operating Mode TN, Normally White, Transmissive 
Support Color 16.7M   72% NTSC
Light Source CCFL  [4 pcs] , 40K hours , W/O Driver
Weight 2.00Kgs (Typ.)
Designed For Desktop Monitor
Frame Rate 60Hz
120Hz (60HZ Input) : Embedded MEMC Circuit
120Hz+120Hz : 120Hz Panel+120Hz Backlight
240Hz (60HZ Input) : Embedded MEMC Circuit
Touch Panel Without
Interface Type LVDS (2 ch, 8-bit) , 30 pins Connector
Power Supply 5.0V (Typ.) 
Environment Operating Temperature: 0 ~ 50 °C ; Storage Temperature: -20 ~ 60 °C
CLAA170EA07Q inverter, CLAA170EA07Q power supply, CLAA170EA07Q electronic board, CLAA170EA07Q VGA board, CLAA170EA07Q touchscreen available.

Kyocera KCS057QV1BL-G21 New Stock

#KCS057QV1BL-G21 Kyocera KCS057QV1BL-G21 New Kyocera 5.7 inch Panel 320×240 Color CCFL Parallel Data ; KCS057QV1BL-G21 , KCS057QV1BL-G21 pictures, KCS057QV1BL-G21 price, #KCS057QV1BL-G21 supplier

Email: sales@shunlongwei.com

Panel Brand : Kyocera
Panel Model : KCS057QV1BL-G21 
Panel Type : CSTN-LCD , Panel 
Panel Size : 5.7 inch
Resolution : 320(RGB)×240 , QVGA 
Display Mode : STN, Normally Black, Transmissive 
Active Area : 115.18×86.38 mm
Display Colors : Color  
Response Time : 220/110 (Typ.)(Tr/Td) 
Lamp Type : 1 pcs CCFL   
Signal Interface : Parallel Data (8-bit)  
KCS057QV1BL-G21 inverter, KCS057QV1BL-G21 power supply, KCS057QV1BL-G21 electronic board, KCS057QV1BL-G21 VGA board, KCS057QV1BL-G21 touchscreen available.

FORESEE: Focus on high-end storage innovation and be an enabler of new data center infrastructure

Stimulated by the continuous increase in relevant policies and the accelerated development of the digital economy, data centers, as computing power platforms that carry storage data, transmit data, and carry new-generation digital applications such as artificial intelligence, cloud computing, and blockchain, have become supportive An intelligent base for “cloud, data, and wisdom” in various industries. At the same time, with the gradual implementation of application scenarios such as the Industrial Internet of Things, Internet of Everything, and autonomous driving, and the accelerated pace of digital transformation in various industries, new high requirements for data centers have become inevitable.

In the context of the “new infrastructure” era, the importance of storage systems is increasing day by day

For application scenarios such as government and enterprise smart terminals, industrial Internet of Things, and autonomous driving that are undergoing digital transformation, platform systems such as ERP, CRM, and cloud storage need to achieve uninterrupted normal operation on the basis of storing massive amounts of data, so as to ensure that The normal conduct of day-to-day business. This means that the storage system associated with the data center must have data error correction capability, data protection capability, capacity expansion capability and scalability. Therefore, storage products must also “keep with the times” to keep evolving and iterating.

Driven by innovation, FORESEE continues to provide high-quality storage solutions

FORESEE, a technology-based storage brand from Longsys, focuses on the industry storage field. Relying on long-term continuous R&D investment and technological breakthroughs, it continues to climb to the top of storage, and has successively launched enterprise-level DDR4 R-DIMM, S802 SATA SSD and other products. Among them, the enterprise-level DDR4 R-DIMM memory module adopts 2Rank 72bit architecture, and processes gold fingers with the industry’s highest standard of 30u”. In terms of performance, this product can reach 3200Mhz frequency, has CL19-19-19-19, CL22-22 -22-22 Two kinds of stable and low timing.Excellent performance, which can provide better performance and more stable experience for the data center while meeting the working requirements of the data center.

The S802 SATA SSD uses the original 3D TLC flash memory medium, DRAM-base, and capacitor array. Among them, the original 3D TLC flash media can make its sequential read and write speed reach 550MB/s / 500MB/s, and the random read and write speed can reach 85K/75K, which can bring high-quality performance experience to the data center; The company’s rigorous reliability test ensures that the mean time between failures of the S802 SATA SSD reaches 2 million hours. It is worth mentioning that in terms of hardware technology, the product has newly added power-off protection technology, which can continue to supply stable power supply at the moment of power failure. The cached data and key data stored in the SSD are saved in time to prevent the loss and damage of key data under abnormal conditions, and to escort the safety of data and the normal progress of work. Whether it is enterprise-level or industrial-level storage products, FORESEE has reached the mainstream level in the industry and can meet the different storage requirements of industry and consumer products.

Over the past 22 years, Longsys has developed abundant upstream and downstream resources in the supply chain by relying on its strong innovation capabilities, and has in-depth cooperation with many top semiconductor chip manufacturers. The core competitiveness of equipment and self-developed firmware has steadily improved its position in the storage market. Since the company established the FORESEE brand in 2011, it has devoted itself to the R&D and innovation of industry-level storage products. It has successively established industrial and R&D bases in Shanghai and Zhongshan, and established embedded storage (including industrial storage), industrial storage It has 4 product lines including high-level memory cards, solid-state drives and memory modules. At the same time, FORESEE fully implements the quality management system for all products in the whole line, covering five fields including “resource management process, project quality management, production quality management, supplier quality management, and customer quality management”, and strictly controls every aspect of the product life cycle. It ensures supply chain delivery for industry customers and can provide professional after-sales service.

With the improvement of “new infrastructure” and the completion of the digital transformation of various industries and fields in society, the storage system as the core of the data center will surely usher in a broader space for development. It is foreseeable that FORESEE’s strategy of driving the development of the storage industry with innovative technologies will not only provide more high-quality, stable and reliable storage solutions for the data centers of government and enterprise institutions in the professional market, but also provide more high-quality, stable and reliable storage solutions in the industrial-grade and vehicle-grade markets. shine.

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Chinese companies are aggressively buying global semiconductor equipment!

According to data released by SEMI, the purchase amount of semiconductor manufacturing equipment in mainland China in the first quarter was 5.96 billion US dollars, a year-on-year increase of 70%, second only to South Korea’s 7.31 billion US dollars. As the shortage of cores continues to intensify competition in the global semiconductor industry, China’s procurement of equipment is gradually increasing.

BusinessKorea pointed out that Chinese companies are aggressively buying semiconductor manufacturing equipment around the world.

U.S. sanctions against Chinese companies cannot curb China’s determination to develop the semiconductor industry. Even if China cannot produce cutting-edge semiconductors, it is trying to gain priority in areas such as automotive semiconductors, where supply shortages are growing.

Korean media pointed out that Chinese semiconductor companies are currently purchasing equipment needed for chip production lines in advance. An industry source said, “Chinese semiconductor companies have purchased five to six additional equipment in addition to the equipment they really need.” Another source said that “some companies have doubled their orders.”

In the first quarter of this year, China became the largest buyer of semiconductor manufacturing equipment in the U.S. and Japan, respectively. 32% of Lam Research’s first-quarter sales came from Chinese companies. Although the figure includes sales by non-Chinese companies such as Samsung Electronics and SK Hynix’s factories in China, industry experts believe that equipment purchases by local Chinese companies are also soaring. It is reported that in order to minimize the impact of U.S. sanctions, SMIC also specifically contacted South Korean semiconductor equipment manufacturers.

Chip manufacturing has higher requirements for front-end equipment, but 60% to 70% of this market is dominated by American and Japanese companies. On another level, the US ban is also generating demand for domestic equipment.

In addition, Chinese companies are snapping up semiconductor equipment, and chipmakers such as Samsung Electronics and SK Hynix are continuing to pay attention. Two South Korean companies are planning to expand production and build new fabs, and ensuring sufficient semiconductor manufacturing equipment will be key.


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Eupec BSM100GAL120DLCK New Stock

#BSM100GAL120DLCK Eupec BSM100GAL120DLCK New Infineon 100A/1200V/IGBT+DIODE/2U , BSM100GAL120DLCK pictures, BSM100GAL120DLCK price, #BSM100GAL120DLCK supplier

Email: sales@shunlongwei.com

BSM100GAL120DLCK Description

IGBT Modules 1200V 100A CHOPPER
BSM100GAL120DLCK  2.20 lbs

BSM100GAL120DLCK could be used in High Power Switching, A.C. Motor Controls, D.C. Motor Controls, Uninterruptible Power Supply, Inverter for motor drive
Collector-Emitter voltage Vces:1200V
Gate-Emitter voltage VGES:±20V
Collector current Ic:100A
Collector current Icp:200A
Collector power dissipation Pc:835W
Collector-Emitter voltage VCES:1700V
Operating junction temperature Tj:+150°C
Storage temperature Tstg :-40 to +125°C
Mounting screw torque5.0 N·m
Gewicht weight 160g


#SKHI 24 R SEMIKRON SKHI 24 R New SEMIKRON IGBT-Module 1200V 400A , SKHI 24 R pictures, SKHI 24 R price, #SKHI 24 R supplier

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. Dual driver for halfbridge IGBT Modules
.For 1700 V-IGBT
.5 V input level
.CMOS compatible inputs
.Short Circuit protection by VCE monitoning and swich off
.Drive interlock top/bottom
.Isolation by transformers
.Supply undervoltage protaction(13V)
.Error latch/output
Typical Applications
.Driver for IGBT and MOSFET Modules in bridge Circuits,drives, UPS and wilding inverters
.DS bus viotage up to 1200V
Maximum ratings and characteristics
.Absolute maximum ratings (Tc=25°C unless without specified)
Collector-Emitter voltage Vces:1200V
Gate-Emitter voltage VGES:±20V
Collector current Ic:400A
Collector current Icp:800A
Collector power dissipation Pc:1270W
Collector-Emitter voltage VCES:1700V
Operating junction temperature Tj:-25 to +85°C
Storage temperature Tstg :-40 to +85°C
Mounting screw torque 3.5 *1 N·m
Weight 115g