Taking a stake in Tianyu Semiconductor, Huawei is laying out the third-generation semiconductor track
Huawei Hubble acquires stake in Tianyu semiconductor
On July 1, according to news from Qixinbao, Dongguan Semiconductor “target=”_blank”> Tianyu Semiconductor Technology Co., Ltd. (hereinafter referred to as “Tianyu Semiconductor”) underwent an industrial and commercial change, adding a new shareholder, Huawei Hubble.
At the same time, the registered capital of Tianyu Semiconductor was changed from 90.270527 million yuan to 97.704638 million yuan.
Tianyu Semiconductor was established in 2009 and is located in Dongguan, the southern city of China’s third-generation semiconductors. It is China’s first national high-tech enterprise specializing in the research and development, production and sales of third-generation semiconductor SiC epitaxial wafers;
At the same time, it is also the first company in the supply chain of silicon carbide semiconductor materials in China to obtain automotive quality certification (IATF 16949).
In 2010, Tianyu Semiconductor cooperated with the Institute of Semiconductors of the Chinese Academy of Sciences to jointly establish the Silicon Carbide Institute.
Has dozens of semiconductor-related patents, such as a polishing device that changes the warpage of SiC chips.
At present, Tianyu has the largest silicon carbide epitaxy furnace-CVD in China, with a monthly production capacity of 5,000 pieces.
Can provide n-type and p-type doped epitaxial materials, making Schottky diodes, JFETs, BJTs, MOSFETs, GTOs and IGBTs and other products.
The silicon carbide material researched by Tianyu Semiconductor has outstanding performance advantages, which can effectively improve the power density and efficiency of power devices, reduce system costs, and drive the semiconductor industry in an all-round way.
Huawei enters the third-generation semiconductor field
Huawei’s entry into the third-generation semiconductor field is a very important signal. At present, power semiconductor devices based on silicon materials are approaching their physical limits.
Therefore, the third-generation semiconductor materials represented by silicon carbide (SiC) and gallium nitride (GaN) have begun to receive attention.
It is worth mentioning that since the beginning of this year, Huawei has significantly accelerated the pace of laying out the semiconductor industry chain. Up to now, Huawei has invested in more than 10 semiconductor companies. In the past three years, Huawei has invested in 41 chip semiconductor companies. .
Shenzhen Hubble Technology Investment Co., Ltd., which was established in April this year, aims to help Huawei quickly build a semiconductor self-rescue ecological chain. At present, this ecological chain is closing. At the same time, it has invested in three technology unicorns in just two months.
Shenzhen Hubble’s parent company “Hubble Technology Investment” has a faster investment pace. There are 37 companies in the investment territory, of which 34 are related to semiconductors, involving IC design, EDA, testing, packaging, materials and equipment and other fields. .
It can be seen from Hubble’s investment actions that Huawei is gradually building an independent and controllable industrial chain in the chip field to achieve self-rescue.
In the past two years, Huawei Hubble’s investment has become more and more frequent, which is inseparable from Huawei’s troubles.
In addition to Tianyu Semiconductor, Shenzhen Hubble has also invested in Qiangyi Semiconductor and Yunyinggu.
In terms of the layout of the silicon carbide field, Huawei’s Hubble Technology Investment has also invested in silicon carbide technology manufacturers such as Shandong Tianyue and Han Tiancheng.
Huawei HiSilicon is still the foundation of persistence
Huawei’s HiSilicon division was once one of the top ten semiconductor companies in the world. Although it did not have the ability to manufacture chips, its strong design and R&D level also provided huge help to Huawei.
Many of Huawei’s businesses need to use chips, and these chips are almost independently developed by HiSilicon. However, Huawei HiSilicon suffered a change and the chip could not be produced.
And Huawei’s investment in Tianyu Semiconductor is probably also preparing for the future.
On the one hand, HiSilicon continues to research and develop; on the other hand, it invests in third-generation semiconductor material companies to plan ahead.
These series of investment actions are enough to see that Huawei will establish an independent and controllable chip supply chain, in order to achieve self-sufficiency and avoid dependence on foreign manufacturers.
Recently, news about Huawei’s first fab in Wuhan, Hubei has also spread. According to media reports, the fab was initially only used for the production of optical communication chips and modules. It is planned to start production in stages in 2022, with a total investment of 18 billion.
In the “Huawei Investment Holding Co., Ltd.’s 2019 Phase 1 Medium-Term Notes Prospectus” previously disclosed by Huawei, the proposed Wuhan HiSilicon factory project was proposed, with a total investment of 1.8 billion yuan.
Later, the “Huawei Technology Co., Ltd. Huawei Wuhan R&D and Production Project (Phase II) Plot A Planning and Design Plan Adjustment Announcement Before Approval” published on the website of the Wuhan Municipal Bureau of Natural Resources and Planning shows that this project is the Haisiguang factory.
In Huawei’s territory empire, HiSilicon is an extremely important pole. How far Huawei can go depends on what kind of breakthrough HiSilicon can make.
It can be seen from the companies invested by Huawei that Huawei is already laying out optical chip semiconductors, silicon carbide and other third-generation semiconductors, development tools involved in chips, key component suppliers, and core raw materials.
These companies invested by Huawei are all related to Huawei’s supply chain, and they are all high-tech companies involved in manufacturing. From this, it can be seen that Huawei’s strategic layout has prepared for HiSilicon to enter the field of chip manufacturing.
Huawei’s control of the supply chain through Hubble’s investment has once again confirmed Huawei’s determination to enter the field of chip manufacturing.
Based on the above information, Huawei is gradually making up for its shortcomings, increasing investment and layout in the chip field, and accelerating the research and development of chip design and chip manufacturing related technologies. Among them, HiSilicon has assumed the burden of breakthroughs in Huawei’s future chip field.
Huawei Hubble Investment Focus Evolves
Huawei took precautions and laid out strategic needs in advance, paving the way for HiSilicon to enter the field of chip manufacturing.
In 2019, Hubble invested in Enrepu Microelectronics, which is mainly involved in the field of analog chips and studies the chips that Huawei needs in the construction of base stations.
From the end of 2019 to the first half of 2020, Hubble successively invested in Kunyou Optoelectronics, Haoda Electronics and other companies, and shifted its investment focus to the fields of materials and optoelectronic chips.
In 2021, Hubble successively invested in Jiutongfang Microelectronics, Wuxi Feipu Electronics, and Lixin Software, and began to deploy in the EDA field. At present, Hubble’s investment is mainly concentrated in the field of equipment.
From the point of view of the invested companies, Hubble’s investments are still in the early stage of development, and there is still a certain gap with the leading companies. However, the technologies of these enterprises are all independently developed, and have certain achievements in their respective sub-fields.
Huawei is turning passive into active. In response to the bottleneck problem in the chip industry, Huawei is actively planning for the establishment of an independent and controllable chip supply chain system.
When the ecology is established, when domestic devices are gradually connected to the terminal product supply chain, and when our market is getting bigger and bigger, it also provides domestic enterprises with opportunities for trial and error and improvement.
But since it is a new track, after all, there are many unknown possibilities and difficulties. This road is long and requires the efforts of all parties.
Some references: Business Economics Observation: “Huawei bets on third-generation semiconductors, invests in chip material companies, and the layout is getting clearer”, Sina Finance: “Frequent actions! Huawei joins hands with “A-share partners” to develop the independence of the chip industry controllable
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