Mainz, Germany, September 8, 2020 – The SCHOTT structured glass wafer and slide combination FLEXINITY® now combines the best precision, tight tolerances (below 20 microns (± 10 microns)), maximum thickness and Features include a wide range of widths (from ultra-thin thicknesses of 0.1 – 3.3 mm to ultra-wide diameters of up to 12 inches or more). Multiple types of glass and high levels of structuring enable custom solutions for applications in various industries such as semiconductor and sensing, pressure sensors, camera imaging, optoelectronics and RF/IC packaging, biotechnology and diagnostics, and sustainable energy. With the new production line in Penang, Malaysia, SCHOTT FLEXINITY® offers full cooperation from product design and development to mass production.
Innovations in various application areas are increasing the demand for structured glass wafers, which include unique challenges and different requirements for materials. In addition, miniaturization trends and the need for high precision continue to drive advances in advanced manufacturing of Electronic components. Major technological advancements depend on high-precision structured glass wafers to enable smaller, high-performance components. In today’s highly agile development cycle with multiple improvements in test design, maximum flexibility and speed are a must for component suppliers, but also for prototyping.
Unmatched precision for high-tech applications
The groundbreaking structure of SCHOTT FLEXINITY® glass wafers has unrivaled precision, which is essential for precise positioning and structure alignment in high-tech applications. Tight tolerances below 20 microns (± 10 microns) ensure perfect alignment between components and enable a high-precision system. With the strength and reliability of structural components, FLEXINITY® is highly integrated and efficient in all relevant applications.
Highest versatility to meet a variety of material challenges
The SCHOTT FLEXINITY® product range has been further expanded to offer specific physical and chemical properties, performance and customization options for existing or developing applications. Ultra-thin glass wafers with thicknesses as low as 0.1 mm (minimum structure radius of 100 μm) facilitate further downsizing of electronic components. Available in 12″ (300 mm) diameter extra-wide and wider formats. There is virtually no limit to the number and geometry of through-structure elements that can be selected. Customers can choose from a variety of glass types, including borosilicate glass (D 263® series, MEMpax®, BOROFLOAT 33®) and alkali-free glass (AF 32® eco).
Solutions can be tailored to the application with any combination of specific characteristics, microstructure design, dimensions, surface quality and strength. With decades of experience in various fields of application, SCHOTT experts can find solutions to customer-specific material challenges.
The ideal partner in the product development roadmap
Dr. Ulrich Peuchert, Global Business Development and Product Manager, SCHOTT Specialty Flat Glass and Wafers team, said: “Component manufacturers are looking for more precise, highly customizable solutions. At SCHOTT, we understand the different needs of our customers because we Strong technical strength and familiarity with end applications. Our team of R&D and technical service experts can provide unique solution support for each customer’s vision. We can work with customers to draw development blueprints to improve products or provide revolutionary new solutions.”
At present, the new production line in Penang, Malaysia has fully entered mass production scale to supply products to global customers. With high sampling flexibility and volume production capabilities, FLEXINITY® is the ideal partner from product design and development to volume production.
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