Zhejiang Saijing Asia Pacific, Xuzhou Xinjing Semiconductor… These semiconductor projects usher in new progress
The main plant of Saijing Asia-Pacific Jiashan project has been completed
According to a report from Jiaxing Daily on October 16, at present, the main plant of the IGBT high-power semiconductor project of Sunking Asia-Pacific Company has been completed. Equipment debugging.
According to previous data, the total investment of Saijing Asia Pacific IGBT high-power semiconductor project is 5.25 billion yuan, of which 1.75 billion yuan is invested in the first phase of the project. It plans to build 2 IGBT chip production lines and 5 IGBT module packaging and testing production lines, with an annual output of 2 million IGBTs After the power devices are put into production, the output value is expected to exceed 2 billion yuan, and the tax revenue will exceed 140 million yuan.
The project officially landed in Jiashan in July 2019. It is another capital and technology-intensive project attracted by Jiashan Economic Development Zone after Geke Microelectronics. The project started smoothly on June 10, 2020, and the main plant was completed on October 13. The top, in just 4 months, has created a new speed of project advancement.
Xinjing Semiconductor’s first batch of 12-inch semiconductor wafers rolled off the production line
Recently, the Xuzhou Municipal Committee of the Communist Party of China and the Xuzhou Municipal People’s Government sent a congratulatory letter to Xuzhou Xinjing Semiconductor Technology Co., Ltd. through the “Xuzhou Release” WeChat account.
The congratulatory letter pointed out that Xuzhou Xinjing Semiconductor’s first batch of 12-inch semiconductor large silicon wafers successfully rolled off the production line, which is another major breakthrough in my country’s semiconductor manufacturing process, and also adds a strong touch to “Made in Xuzhou”.
According to information from the Jiangsu Provincial Institute of Economics and Information Technology, the first phase of Xuzhou Xinjing Semiconductor’s large silicon wafer project invested 6.8 billion yuan to build a 12-inch semiconductor large silicon wafer growing and cutting and polishing production line, with an annual planned production capacity of 3.6 million pieces. On December 9, 2019, the trial production of Xuzhou Xinjing Semiconductor’s 12-inch large silicon wafer growth line was successful.
It is reported that this project is a major construction project in Jiangsu Province, which has been supported by special funds for strategic emerging industries in Jiangsu Province. It is also another layout of GCL Group in Xuzhou after the Jiangsu Xinhua Semiconductor project was put into operation.
Meishan Guoxin IC packaging and testing project was completed and put into production
On October 18, the integrated circuit packaging and testing project of Meishan Guoxin Technology Co., Ltd. was officially completed and put into production.
According to a report from the Rong Media Center in Dongpo District, Meishan City, Meishan Guoxin Technology Co., Ltd. is a high-tech private enterprise integrating R&D, manufacturing, sales and service. It is a professional semiconductor packaging and testing complete solution provider.
The core technical strength of Meishan Guoxin Technology Co., Ltd. comes from advanced IC packaging and testing teams in Taiwan, Europe and the United States. The products are mainly used in the fields of home appliance intelligence, Internet of Things, new energy vehicles, 5G communication products and AI artificial intelligence. After the project reaches full production, it will reach an annual output of 5 billion chips, achieve sales revenue of more than 1 billion yuan, and tax revenue of more than 100 million yuan.
At the commissioning ceremony, Meishan Guoxin Technology Co., Ltd. also signed a centralized contract with Taiwan Xinyi Electronic Technology Co., Ltd., Aerospace 502, Dongshen (Hong Kong) Enterprise Group Co., Ltd., Thailand C&D Group Co., Ltd., etc.
The first phase of Sandi Semiconductor Optoelectronics Industry Project was completed and put into production
On October 18, the first-phase project of Sandi Semiconductor Optoelectronics Industry invested and constructed by Xinjiang Sandi Optoelectronics Technology Co., Ltd. was completed and put into operation. After the project is fully completed and effective, it can produce 8 billion semiconductor electronic components annually, provide more than 500 jobs, and have an annual output value of over 500 million yuan.
According to the Corps Daily, Xinjiang Sandi Optoelectronics Technology Co., Ltd. is a company engaged in the research and development, design, manufacture, packaging, testing and sales of semiconductor optical devices. The Sandi Semiconductor Optoelectronics Industry Project is a key investment attraction project in Kekedala City , mainly to build a whole industry chain of semiconductor, chip, integrated circuit packaging research and development.
The project was officially settled in the Corps division on June 14 this year, with a construction area of 72,000 square meters. The first phase of the project has completed the investment of 900 million yuan in fixed assets. The chip bonding wire, testing and packaging equipment has been put into production first, and the products will enter the five Central Asian countries, Russia and Europe.
Goertek smart device packaging and testing project put into production
On October 18, the opening ceremony of the Rongcheng Goertek Electronic Information Industrial Park and the commissioning of the smart device packaging and testing project was held.
The Rongcheng Goertek Electronic Information Industrial Park project started construction in 2019. After it is put into use, it will give full play to Goertek’s advantages in technology, market, talents and operations in the field of microelectronics, focusing on the packaging and testing of smart devices, and the R&D and manufacturing of consumer electronic products. , The products are mainly used in microelectronics, automobiles, consumer electronics and other fields.
In November 2018, Goertek and Rongcheng Municipal People’s Government signed the “Project Cooperation Agreement”. The agreement stated that Goertek and Rongcheng Municipal People’s Government plan to jointly invest in the construction of a smart device packaging and testing project. The total investment of this project is 900 million yuan, and the annual production capacity of 1 billion smart devices can be realized after the project is put into production.
It is reported that this project is a new generation of information technology key industrial projects introduced and implemented by Rongcheng City, and it is also one of the key projects in Shandong Province and one of the new target projects of 3 billion yuan for enterprises in Weihai City. It will play an important role in accelerating the transformation of new and old kinetic energy in the new generation of information technology industry, expanding the scale of the industry, and improving the efficiency of industrial development.
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